Monday, June 29, 2026
4:00 PM-5:00 PM
US Chamber of Commerce, 1615 H Street NW

On the margins of the upcoming June 25th Pax Silica Summit in Washington, the U.S. Chamber of Commerce is convening a small, closed-door dialogue with key Southeast Asia partners and member companies to explore emerging opportunities in AI supply chains. The discussion will bring together senior government stakeholders from the Philippines, Singapore, and New Zealand to examine how their complementary strengths can form a fully integrated and resilient regional value chain for AI hardware and semiconductors. We expect a number of announcements and agreement to come out of the June 25 Summit and look forward to discussing those further during this exchange as well. 

Participants will include:

Ceferino "Perry" Rodolfo, Undersecretary for the Department of Trade and Industry & Vice Chairman of the Board of Investments, Republic of the Philippines

Tan Chye Hee, Permanent Secretary for Information and Development, Ministry of Digital Development and Information (MDDI), Republic of Singapore